Do you know the four special electroplating methods in the circuit board production process?

There are four special electroplating methods in the production of circuit boards, which refer to the electroplating equipment, coating electroplating, and rolling wheels. This article introduces these four special methods in detail.

1. Finger -type electroplating equipment

In the electroplating, rare metals are often placed on the edge of the plate, the edge of the plate, or the golden fingers to provide lower contact resistance and high abrasion resistance. Essence

In the electroplating, it is also often plated on the inner layer of the nickel plate edge connector to highlight the contact. The protruding part of the golden finger or plate edge uses manual or automatic electroplating technology. At present, the gold plating on the plug or the gold finger has been plated. Instead of lead and plating button.

2. Pole electroplating

There are many ways to establish a layer of electroplating on the hole wall of the substrate drilling hole in the pores of the substrate, which is called the hole wall activation in industrial applications. Its printed circuit commercial production process requires multiple intermediate storage tanks, and each storage slot has its own control and maintenance requirements.

Pole plating is a follow -up process of drilling. When the drill bit drills the copper foil and the substrate below, the heat generates the insulation synthetic resin melting, the melted resin and other drilling fragments that constitute the substrate substrate. Packing around the holes, coating on the newly exposed hole wall in the copper foil.

In fact, this subsequent plating surface is harmful. The melting resin will also leave a layer of heat shaft on the wall of the substrate hole. The technology that looks like staining and eroding chemistry: Ink!

The ink is used to form a high -stick, high -electroconductor -oriented film on the inner wall of each pass, so that there is no need to use multiple chemical processing processes, just one application step, and then the heat solidification can be performed. Continuous membranes are formed in the inner side, and it can directly electroplating without further treatment. This kind of ink is a resin -based substance. It has a strong adhesion and can be eased on the wall of most thermal polishing, which eliminates this step back.

3. Choose plating of rolling wheels

The pins and pins of electronic components, such as connectors, integrated circuits, transistors, and flexible print circuits, etc., are selected to obtain good contact resistance and corrosion resistance.

This electroplating method can be used by handmade electroplating production lines, or automatic electroplating equipment. Selection of each pinrse alone is very expensive. Therefore, batch welding must be adopted. Gold, nickel -lead alloys, etc. are continuously plated.

4. Plating

The last method is called "brush plating": it is a type of electrical deposition technology, not all parts of the electroplating process are not immersed in the electrolyte. In this electroplating technology, only electroplating on limited areas, and has no impact on the rest.