Multilayer Pcb Production
The production method of multi-layer boards is generally made by the inner layer pattern first, and then the single-sided or double-sided substrate is made by printing and etching method, and is incorporated into the designated interlayer, and then heated, pressurized and bonded. As for the subsequent drilling The hole is the same as the plated-through hole method of the double-sided board.
Description
Product Detail
Specifications | Standard | Custom |
Layer: | 1- 10 Layers | 1- 48 Layers |
Lead time: | 5Day - 7Day | 8Day - 4 Weeks |
Quantity: | 1 - 10000+pcs | 1 - 10000+pcs |
Materials: | FR4 | FR-4/Rogers/PI/Alu/High-TG/Others |
Surface Finish: | HASL/ENIG | Electrolytic Hard Gold/Soft Gold/ENIG/Nickel/Immersion Silver OSP/HSAL |
Qualifications: | IPC Class 2 | IPC6018 Class 3 /more |
Board Thickness: | 1.6mm | 0.3-1.6mm |
Solder Mask: | Green, Blue | Various Color Options |
Silkscreen: | White, Black | Various Color Options |
Copper Weight: | 1 OZ | 0.5OZ-20OZ |
Trace/Space: | 5/5mil | 2.75 / 3mils |
Multilayer board production
(1) In order to increase the area that can be wired, more single or double-sided wiring boards are used for multi-layer boards. Multi-layer boards use several double-layer boards, and put a layer of insulating layer between each layer of boards and then glue them (pressed). The number of layers of the board represents several independent wiring layers, usually the number of layers is even, and includes the outermost two layers. Most motherboards are 4 to 8 layers of structure, but technically it is possible to achieve nearly 100 layers of PCB boards.
(2) Most of the large-scale supercomputers use fairly multi-layer motherboards, but because these types of computers can be replaced by clusters of many ordinary computers, super-multi-layer boards have gradually disappeared. Because the layers in a PCB are so tightly bound, it's usually not easy to see the actual number, but if you look closely at the motherboard, you might be able to.
(3) Guide holes, if applied to a double-layer board, must be pierced through the entire board. However, in a multilayer board, if you only want to connect some of these traces, then vias may waste some trace space on other layers.
(4) Buried and blind via technologies can avoid this problem because they only penetrate a few of the layers. Blind vias connect several layers of internal PCB to the surface PCB without penetrating the entire board. Buried vias are only connected to the internal PCB, so they cannot be seen from the surface.
In a multi-layer PCB, the entire layer is directly connected to the ground wire and the power supply. So we classify each layer as signal layer, power layer or ground layer. If the parts on the PCB require different power supplies, usually such PCBs will have more than two layers of power and wires.
Features of multilayer circuit boards:
1. The multi-layer circuit board has high assembly density and small volume.
2. The multi-layer circuit board is convenient for wiring, and the wiring length and the connection between components are shortened, which is beneficial to improve the speed of signal transmission.
3. For high-frequency circuits, after adding the ground layer, the signal line forms a constant low impedance to the ground layer, the circuit impedance is greatly reduced, and the shielding effect is better.
4. For electronic products with high requirements for heat dissipation, multi-layer circuit boards can be provided with a metal core heat dissipation layer to meet the needs of special functions such as shielding and heat dissipation.
5. In terms of performance, multi-layer circuit boards are better than single and double-sided boards, but the higher the number of layers, the greater the production cost, the longer the processing time, and the more complicated the quality inspection.
6. Four or six-layer boards are common in multi-layer circuit boards. The difference between a four-layer board and a six-layer board is that there are two more internal signal layers between the middle layer, the ground layer and the power layer. The four-layer board should be thicker.
In general, multi-layer circuit boards have been widely used in the production of electronic products due to their design flexibility, economic advantages, stable and reliable electrical performance and other characteristics.
The multilayer PCB application
With the continuous development of electronic technology and the continuous improvement of the requirements for electronic equipment in the computer, medical, aviation and other industries, the circuit board is developing in the direction of reducing the volume, reducing the quality and increasing the density. Due to the limitation of available space, it is impossible to further increase the assembly density of single and double-sided printed boards. Therefore, it is necessary to consider the use of multi-layer circuit boards with higher number of layers and higher assembly density. Multilayer circuit boards have been widely used in the production of electronic products due to their flexible design, stable and reliable electrical performance and superior economic performance.
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