Knowledge

AI Servers & Data Centers: Technical Requirements for Next-Gen PCB Materials

AI computing demands flawless signal integrity. Discover how Beton achieves ±5% impedance control using Rogers high-frequency materials and advanced HDI technology for next-gen AI

Al2O3, AIN, SiC...Comparison of performance and application fields of differe...

Alumina, aluminum nitride, silicon carbide... Performance comparison and applicable fields of different ceramic materials At present, common ceramic substrate materials mainly incl

How to determine how many orders there are in blind/buried via HDI PCB Board

Blind/buried HDI (High Density Interconnect) board is an advanced printed circuit board technology that uses tiny blind and buried vias to increase the wiring density on the circui

‌Direct Plated Copper DPC Technology in Ceramic PCBs

The rapid evolution of microelectronics demands advanced materials and processes that deliver superior thermal management, high-density integration, and reliability. Direct Plated

What are the differences between flexible board copper foil and rigid board c...

Introduction to FPC FPC is a technology developed by the United States in the 1970s for the development of space rocket technology. It is a printed circuit board with high reliabil

Why are BGA solder joints prone to oxidation

In electronic packaging, BGA (Ball Grid Array) is undoubtedly one of the most frequently used electronic packaging methods and is widely used in various high-performance electronic

What is PTH Flash plating

PTH Flash plating is a key process in the manufacturing process of PCB (printed circuit board). Its main purpose and function is to deposit a thin layer of chemical copper on the n

What are key features and applications of the Rogers RT/duroid® laminate seri...

High frequency PCB board material Rogers RT/duroid® laminate series introduction Rogers RT/duroid® high-frequency circuit materials are composite laminates of PTFE with ran

TU-722/TU-72P laminated board

TU-722/TU-72P laminates/prepregs not only significantly enhance heat resistance, but also exhibit excellent UV protection properties, making them perfectly compatible with AOI (Aut

TU-768 rigid flexible board

TU-768 rigid flexible board, also known as rigid flexible combination board or rigid flexible combination board, is a special type of circuit board. It combines the characteristics

TMM6 is an efficient thermal management material

TMM6 is a high-frequency material mainly used in the field of thermal management of electronic devices. It has excellent thermal conductivity and high temperature resistance, which

TMM4 High Performance High Frequency Microwave Laminate

TMM4 is a high-performance high-frequency microwave laminate produced by Rogers. This material is a unique ceramic, hydrocarbon, and thermosetting polymer composite material that s