CU4000 LoPro ® What are the characteristics of electrolytic copper foil products?

CU4000 LoPro ® The characteristics of electrolytic copper foil products are as follows:

Reverse processing technology: CU4000 LoPro ® The copper foil adopts a special reverse treatment process, which makes the copper foil have a very thin adhesive layer to enhance the adhesion between the smooth copper foil and the medium.
Reduce circuit losses: At high frequencies, CU4000 LoPro ® Copper foil can reduce circuit losses, which is particularly important for the application of high-frequency circuits.
Optimizing Multilayer Board Design: In line with RO4000 ® When using laminated panels together, CU4000 LoPro ® Copper foil can optimize the accuracy of multi-layer board frames while reducing the need for semi cured sheet filling.
High peel strength: Due to the use of a special reversal treatment process, the CU4000 LoPro ® Copper foil in RO4400 ™ The series of semi cured chip materials have higher peel strength, ensuring the stability and reliability of the circuit board.
High temperature resistance and elongation: CU4000 LoPro ® Copper foil is a high temperature and high elongation copper foil of grade 3 in IPC-4562, with excellent high temperature resistance and elongation performance, which can meet the needs of various high-end applications.