Fine Quality 2f Communication Composite Board
Beton use clean rooms for material layup, flying probe electrical testing, and controlled impedance modeling and test/verification to ensure that you receive the best rigid flex circuits available.
Description
Model Number | PCB-597 |
Place of Origin | Guangdong, China |
Brand Name | OEM/ODM |
Base Material | FR-4 |
Copper Thickness | 1oz |
Board Thickness | 1.6mm |
Min. Hole Size | 0.2mm |
Min. Line Width | 0.2mm |
Surface Finishing | HASL |
Solder mask color | White Black Red Yellow |
Service | One-Stop OEM Service |
Certificate | ROHS, CE, ISO9001 |
In order to shorten the signal transmission distance and reduce the signal transmission loss, the 5G communication board,Gradually move towards high-density wiring, fine wire spacing,The development of small aperture, thin profile and high reliability. 
Accumulated Experience In Manufacturing Communication Board Of Huihe Circuits
High Density Requirements:
The influence of crosstalk (noise) will decrease as the line width/spacing (L/S) shrinks.
Strict Impedance Requirements:
Characteristic impedance matching is the most basic requirement for high-frequency microwave boards. The greater the impedance, the greater the ability to prevent the signal from penetrating the dielectric layer, the faster the signal transmission and the smaller the loss.
Transmission Line Production Accuracy Is High:
The transmission of high-frequency signals has strict requirements on the characteristic impedance of the printed wire, that is, the production accuracy of the transmission line is generally ±lmil, and the edges of the transmission line must be very neat, and no burrs, gaps, or repairs are allowed.
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