Aluminum substrate feature

Aluminum substrate (metal-based heat sink (including aluminum substrate, copper substrate, iron substrate)) is a low-alloyed Al-Mg-Si series high-plastic alloy plate, which has good thermal conductivity, electrical insulation properties and mechanical processing properties. Compared with the traditional FR-4, the aluminum substrate adopts the same thickness and the same line width, the aluminum substrate can carry higher current, the aluminum substrate withstand voltage can reach 4500V, and the thermal conductivity is greater than 2.0. host.

●Using surface mount technology (SMT);

●Very effective treatment of thermal diffusion in circuit design;

●Reduce the operating temperature of the product, improve the power density and reliability of the product, and prolong the service life of the product;

●Reduce product size, reduce hardware and assembly costs;

●Replace the fragile ceramic substrate for better mechanical durability. structure

Aluminum-based copper clad laminate is a metal circuit board material, which consists of copper foil, thermal insulation layer and metal substrate. Its structure is divided into three layers:

Circuit Layer: It is equivalent to the copper clad laminate of ordinary PCB, and the thickness of the copper foil of the circuit is 10oz to 10oz.

Dielcctric Layer insulating layer: The insulating layer is a layer of low thermal resistance thermally conductive insulating material. Thickness: 0.003" to 0.006" inch is the core technology of aluminum-based copper clad laminate, which has obtained UL certification.