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High Density Interconnect PCB

High Density Interconnect PCB is a structural component formed by insulating material supplemented by conductor wiring. When the final product is made, integrated circuits, transistors, diodes, passive components (such as resistors, capacitors, connectors, etc.) and various other electronic parts are mounted on it. Through the connection of wires, electronic signal connections and due functions can be formed. Therefore, the printed circuit board is a platform that provides component connection, and is used to undertake the basis of connecting parts.

Description

Product detail

High Density Interconnect PCB specification

Layer count:4-22 layers standard, 30 layers advanced

HDI builds:1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D

Materials:FR4 standard, FR4 high performance, Halogen free FR4, Rogers

Copper weights (finished):18μm – 70μm

Minimum track and gap 0.075mm / 0.075mm

PCB thickness: 0.40mm – 3.20mm

Maximum dimensions:610mm x 450mm; dependant upon laser drilling machine

Surface finish: OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers

Minimum drilling:0.15mm

Minimum laser drilling:0.10mm standard, 0.075mm advanced

 High density interconnect PCB circuit board

What is the High Density Interconnect PCB?

The circuit board is a structural element formed of insulating materials and conductor wiring. It will be mounted on the surface before it is made into the final product: integrated circuits, transistors, diodes, passive components (such as resistors, capacitors, connectors and other electronic components) Parts will also be matched with peripheral functional components. Electronic signal connections and various functions can be formed through wire connection, so the circuit board is a platform for component connection, which is used to undertake and connect the base of parts.)

 

Since the circuit board is not a terminal product, the definition of the name is slightly confusing. For example, the motherboard for personal computers is called a motherboard and cannot be called a circuit board. Although the motherboard has a circuit board as a constituent element, it is not the same. Therefore, although the two are related, they cannot be said to be the same. Another example: there are IC components installed on the circuit board, the media calls it an IC board, but it is not the same as a circuit board in essence.

 

Electronic products are too small and multi-functional, the contact distance of IC components is reduced, the signal transmission speed is relatively high, the wiring volume is increased, and the wiring length is partially shortened. These require high-density circuit configuration and micro-hole technology to achieve the goal. . Generally, wiring and jumping can be completed by double-sided boards, but it is difficult to handle complex signals and adjust electrical stability, so the circuit board will be multi-layered. In addition, due to the increasing number of signal lines, more power and ground layers must be added, which has led to the popularity of Multilayer Printed Circuit Boards.

 

For products with high frequency requirements, the circuit board must provide: characteristic impedance control, high frequency transmission, low radiation (EMI) interference and other performance. To adopt structures such as stripline and microstrip line, multi-layer design is necessary at this time. In order to improve the quality of signal transmission, high-end products will use insulating materials with low dielectric constant (Dk) and low attenuation rate (Df). Density according to demand. The development of BGA (Ball Grid Array), CSP (Chip Scale Package), DCA (Direct Chip Attachment) and other components has pushed the circuit board to an unprecedented high density state.

 

 

Why use the High Density Interconnect PCB

 

1) The same product design can reduce the number of layers of the carrier board, increase the density and reduce the cost

 

2) Increase the wiring density and increase the line capacity per unit area with micro-hole thin lines, which can meet the assembly requirements of high-density contact components, and is conducive to the use of advanced packaging

 

3) The use of micro-hole interconnection can shorten the contact distance, reduce signal reflection, and crosstalk between lines, and the components can have better electrical properties and signal accuracy

 

4) The structure adopts a thinner dielectric thickness, and the potential inductance is relatively low

 

5) The micro-hole has a low aspect ratio, and the reliability of serial number transmission is higher than that of the general through-hole

 

6) Micro-via technology allows the carrier board design to shorten the distance between grounding and signal layers, thereby improving RF/EM wave/Electrostatic discharge (RFI/EMI/ESD) interference. The number of grounding wires can be increased to prevent the damage of components caused by instantaneous discharge due to static electricity accumulation.

 

7) Micro holes can improve the flexibility of circuit configuration and make circuit design easier

 

Modern and popular electronic products should not only have the characteristics of mobility and power saving, but also need no burden to wear and look beautiful. Of course, the most important thing is that they are affordable and can be replaced with fashion. Figure 2 shows a representative example of a mobile electronic product.

Eletronic product


Beton Tech FAQs

Q1 : What are needed for quotation?

PCB:Quantity,Gerber file and Technic requirements(material,surface finish treatment,copper,thickness,board thickness...)

PCBA : PCB information,BOM,(Testing documents)

 

Q2 :Are my files safe?

Your files are held in complete safety and security.We protect the intellectual property for our customers in the whole process.All documents from customers are never shared with any third party.

 

Q3 : What's your MOQ?

We have no MOQ.We can flexibly handle small and mass production.

 

Q4 : How about the delivery ?

Normally,our delivery time is about 5 days for sample order.

For small batch,our delivery time is about 7 days.

For mass proudction,our delivery time is about 10 days .

If your order is very urgent,please let us know and we will arrange for you fastest!

 

Q5 : How can I order your products?

You can buy our products in 2 ways: The first way is you enquire the product to our salespersons directly and we will draft an order for you to confirm and pay after agreement reached between you and us. The other way is that, if the product can buy online, you can place an order on the products in yourself service.You are welcome to contact us directly.

 


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