Any Layer HDI PCB

Name: Any Layer HDI PCB
Brand: Beton
SKU: 174995296

All layers are staggered and stacked copper-filled laser vias
Up to 14 layers per side, 6 high-density interconnect buildup layers
Halogen Free Based Materials (Medium to High TG)
Edge plating technology, protection space optimization and assembly

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Description

Product Detail

(Any-layer HDI) is a high-end HDI process. The difference is that, in general HDI, the machine drill in the drilling process directly penetrates the layers between the PCB layers, while Any-layer HDI uses laser drilling to get through the layers. For the connection between the layers, the copper foil substrate can be omitted for the intermediate substrate, which can make the thickness of the product thinner and lighter. Changing from HDI first-order to Any-layer HDI can reduce the volume by nearly 40%.

Parameters

Layers: 14 layer HDI any-layer PCB

Board Thickness:1.6mm

Min Holes:0.2mm

Minimum Line Width/Clearance：0.075mm/0.075mm

Minimum Clearance between Inner Layer PTH and Line： 0.2mm

Size：107.61mm×123.45mm

Aspect Ratio：10 : 1

Surface treatment：ENEPIG+ Gold Finger

Speciality: Any layer hdi pcb, high speed material, hard gold plating for edge connectors,insertion loss test, Z-axis milling,Laser via copper plated shut

Special Process：Thickness of Gold finger:12“

Differential impedance 100+7/-8Ω

Applications:Optical module

Any layer HDI PCB board

Any layer HDI PCB features

(1) Laser drilling opens the connection between layers, and the copper-clad substrate can be omitted for the intermediate substrate, which can make the thickness of the product thinner and lighter. Changing from HDI first-order to using Any-layer HDI can reduce nearly 40% volume around;

(2) The interlayer alignment adopts the base layer as the carrier, and the subsequent layers are aligned to the front layer by layer, and the best interlayer alignment accuracy can reach 10 microns;

(3) The wiring density and hole density are higher than those of conventional HDI boards, which are more in line with the requirements of smaller, lighter and thinner HDI boards in the future.

6 layer PCB stackup

Any layer HDI PCB Manufacturing processes：

(1)Using the epoxy copper clad substrate (FR-4) as the base layer, first drill the alignment holes through mechanical drilling, and then paste the concentrating dry film on the surface. Hole making micro-holes;

(2)Use the horizontal electroplating hole filling method to fill up the laser holes to form blind holes;

(3)The image transfer pattern is formed by film and CCD alignment exposure to form a circuit; at the same time, the alignment target of the next layer is transferred to the base layer;

(4)Using the conventional prepreg lamination method, the copper foil is made of electrolytic copper foil with a thickness of 12 microns, and the next level is formed by pressing the plate forming method;

(5)Through the X-RAY visual recognition system, the target is drilled out as the next-level graphic alignment target;

(6)by acid etching the solution, the copper foil is slightly etched to 8 microns with a uniform thickness;

(7)Laser light-absorbing layer fabrication (browning or blackening); then make micro-holes through the process of directly punching copper by laser; h. Repeat steps b to g until the required level is completed; the above is the specific implementation of the patent of the present invention. Explanation, but the patented creation of the present invention is not limited to the described embodiments, and those skilled in the art can make various equivalent deformations or replacements without violating the spirit of the patent of the present invention, and these equivalent deformations or replacements all include within the scope defined by the claims of the present application.

a. The epoxy copper clad substrate (FR-4) is used as the base layer; the micro-holes are made by laser;

b. Use the horizontal electroplating hole filling method to fill the laser holes to form blind holes;

c. Image transfer pattern through film and CCD alignment exposure to form a circuit;

d. Use the conventional prepreg lamination method (by pressing plate forming method) to form the next level;

e. The second-order micro-holes are then made by laser, and steps b, c and d are repeated until the required layers are completed. This processing method is applied to the production of HDI boards with arbitrary interconnection of lines.

FAQs

Q1. What is needed for PCB/ PCBA quotation?

A: PCB: Quantity, Gerber file and Technic requirements (material, surface finish treatment, copper thickness, board thickness, ...)

PCBA: PCB information, BOM, (Testing documents...)

Q2. What file formats do you accept for PCB PCBA production?

A:Gerber file: CAM350 RS274X

PCB file: Protel 99SE, P-CAD 2001 PCB

BOM: Excel (PDF,word,txt)

Q3. Are my files safe?

A: Your files are held in complete safety and security. We will protect the intellectual property for our customers in the whole

process. All documents from customers are never shared with any third parties.

Q4. MOQ?