HDI PCB Print Circuit Board
HDI Printed Circuit boards, one of the fastest growing technologies in PCBs containing blind and buried vias and often containing microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
Description
Product Detail
Beton factory offers solutions for low-volume/high-volume PCB manufacturing on a quick turn basis. HDI PCB Print Circuit Board is for advanced builds with demanding requirements for aerospace, defense, medical, and commercial applications.
Monthy Capability | 3000-5000 m²/month |
Layer | 6 Layers |
Material | FR4, TG180 |
Finished board thickness | 2m |
Min Trace Width/Space | 3.5mil |
Min hole size | 0.2mm |
Min copper in hole thickness | 1oz |
Outer layer Finished copper thickness | 1.5oz |
Inner layer base copper thickness | 1oz |
Impedance Control Tolerance | ±10% |
What's High Density Interconnects (HDI) board
High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (<400 µm), I/O>300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.
According to layer up different, currently DHI board is divided into three basic types:
1) HDI PCB (1+N+1)
Features:
● Suitable for BGA with lower I/O counts
● Fine line, microvia and registration technologies capable of 0.4 mm ball pitch
● Qualified material and surface treatment for Lead-free process
● Excellent mounting stability and reliability
● Copper filled via
Application: Cell phone, UMPC, MP3 Player, PMP, GPS, Memory Card
2) HDI PCB (2+N+2)
Features:
● Suitable for BGA with smaller ball pitch and higher I/O counts
● Increase routing density in complicated design
● Thin board capabilities
● Lower Dk / Df material enables better signal transmission performance
● Copper filled via
Application: Cell phone, PDA, UMPC, Portable game console, DSC, Camcorder
3) ELIC (Every Layer Interconnection)
Features:
● Every layer via structure maximizes design freedom
● Copper filled via provides better reliability
● Superior electrical characteristics
● Cu bump and metal paste technologies for very thin board
Application: Cell phone, UMPC, MP3, PMP, GPS, Memory card.
The Advantages to use High Density Interconnects (HDI) board
● Allows designers to incorporate more components onto smaller boards because HDI PCBs can be populated on both sides of the board.
● Decrease power usage, leading to longer battery life in handheld and other battery powered devices.
● More solid and rugged, allowing for increased strength and limited perforations
● Reduced thermal degradation, elongating the life of the device.
● Allow for more efficient and higher density transmission and computation in smaller areas and the creation of smaller end-user products such as smartphones, aerospace equipment, military devices, and medical equipment.
● Sustainability of Dense BGA and QFP Packages in PCB Design
● If you are using smaller BGA and QFP packages in your designs and applications, HDI PCBs offer more reliability in transmission when your PCB design gets to the point of mass production. HDI PCBs can accommodate more dense BGA and QFP packages than older PCB technology.
● Reduced Heat Transfer
Heat transfer is reduced because there is less distance for heat to travel before it can escape an HDI PCB. HDI PCBs also undergo less stress due to thermal expansion, extending the life of the PCB.
● Managed Conductivity
Vias can then be filled with conductive or non-conductive materials to facilitate transmission between components depending on your board design.
Functionality is also improved as blind vias and via-in-pad allow components to be placed closer together. When the transmission range from component to component is reduced, transmission times and crossing delays are decreased, while signal strength is increased.
● Smaller (and Smaller) Form Factors
When it comes to saving space, HDIs are a fantastic option as the total number of layers can be reduced. For example, a traditional 8-layer through-hole PCB can easily be replaced by a 4-layer HDI via-in-pad solution. This results in smaller PCBs that contain vias that are more or less invisible to the naked eye.
Ultimately, using HDI PCBs allow for the creation of smaller, more durable, and more efficient products that consumers want without compromising design and overall performance.
HDI Structures:
1+N+1 – PCBs contain 1 “build-up” of high-density interconnection layers.
i+N+i (i≥2) – PCBs contain 2 or more “build-up” of high density interconnection layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.
Any Layer HDI – All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures (“any layer via”). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld devices.
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