What Is The Difference Between FCBGA Package And BGA

For decades, chip packaging technology has been following the development of IC. Each generation of IC has a corresponding generation of packaging technology to match.

In order to cope with the strict requirements of integrated circuit packaging and the rapid increase in the number of I/O pins, resulting in increased power consumption, in the 1990s, BGA (ball grid array or solder ball array) packaging came into being.

BGA packaging technology is a high-density surface mounting packaging technology: the bottom pins of the chip are balled and arranged in a grid shape. Compared with traditional packaging technology, BGA packaging has better heat dissipation performance, electrical performance and smaller size. Memory packaged with BGA technology can reduce the size to one-third without changing the memory capacity.

BGA packaging is an indispensable technical means for current chip manufacturing.

BGA packaging classification and characteristics

BGA packages can be divided into staggered type, full array type, and peripheral type according to the arrangement of solder balls.

According to the packaging form, it can be divided into TBGA, CBGA, FCBGA, and PBGA.

TBGA:

Carrier tape solder ball array is a relatively new form of BGA packaging. It uses low-melting-point solder alloy during welding, the solder ball material is high-melting-point solder alloy, and the substrate is a PI multi-layer wiring substrate.

It has the following advantages:

① In order to meet the alignment requirements of the solder ball and the pad, the self-alignment effect of the solder ball is used to print the surface tension of the solder ball during the reflow soldering process.

②The flexible carrier tape of the package can be compared with the thermal matching of the PCB board.

③It is an economical BGA package.

④Compared with PBGA, the heat dissipation performance is better.

Package renderings

CBGA:

Ceramic solder ball array is the oldest BGA packaging form. The substrate is a multi-layer ceramic. In order to protect the chip, leads and pads, the metal cover is welded to the substrate with sealing solder.

It has the following advantages:

① Compared with PBGA, the heat dissipation performance is better.

② Compared with PBGA, it has better electrical insulation properties.

③ Compared with PBGA, the packaging density is higher.

④ Due to its high moisture resistance and good air tightness, the long-term reliability of packaged components is higher than that of other packaged arrays.

FCBGA:

Flip chip ball grid array is the most important packaging format for graphics acceleration chips.

It has the following advantages:

①Solved the problems of electromagnetic interference and electromagnetic compatibility.

②The back of the chip is in direct contact with the air, making heat dissipation more efficient.

③It can increase the density of I/O and produce the best usage efficiency, thus reducing the FC-BGA packaging area by 1/3~2/3 compared with traditional packaging.

Basically all graphics accelerator card chips use FC-BGA packaging.

PBGA:

Plastic solder ball array package, using plastic epoxy molding compound as the sealing material, using BT resin/glass laminate as the substrate, the solder balls are eutectic solder 63Sn37Pb or quasi-eutectic solder 62Sn36Pb2Ag

It has the following advantages:

① Good thermal matching.

② Good electrical performance.

③ The surface tension of the molten solder ball can meet the alignment requirements of the solder ball and the pad.

④ Lower cost.