Why Are BGA Solder Points Easily Oxidized

In electronic packaging, BGA (Ball Grid Array) is undoubtedly one of the most frequently used electronic packaging methods. It is widely used in various high-performance electronic equipment. However, during the understanding process, it is easy to encounter BGA solder joints. It is prone to oxidation problems, so what is the reason for promoting growth?

1. Why are BGA solder points easily oxidized?
Environmental factors: Oxygen and moisture in the air are the main factors causing oxidation of BGA solder joints. If the solder joints are exposed to the air for too long, or the ambient humidity is too high during storage or transportation, the surface of the solder joints will be oxidized.

Material factors: Chemical differences in solder ball and substrate materials may also cause oxidation of solder points. For example, some materials tend to react with oxygen under certain circumstances to form oxides.

Process factors: Improper setting of welding process parameters, such as too high welding temperature, too long welding time, etc., may lead to excessive oxidation of the surface of welding points.

2. How to solve the oxidation problem of BGA solder points?

Cleaning agent cleaning: Use suitable cleaning agents and cleaning methods to remove the oxide layer on the surface of BGA soldering points. When selecting a cleaning agent, the composition and applicability of the cleaning agent should be fully considered to avoid damage to solder joints or other components. Ensure adequate rinsing and drying during the cleaning process to prevent residues from causing secondary contamination or oxidation.

Surface treatment agent: Use surface treatment agents, such as activators or oxygen scavengers, to remove the oxide layer and repair the surface of BGA solder points. These chemicals react with the oxide layer, converting it into a weldable metal surface. Before using a surface treatment, read the product instructions carefully and follow the recommended usage.

Add flux: During the soldering process, an appropriate amount of flux can be added to help remove oxides from the surface of solder points. Flux can reduce the tension on the surface of the solder joint and promote good bonding between the solder ball and the substrate. At the same time, the active ingredients in the flux can also react with oxides to further reduce the degree of oxidation.