PCB Power Control Board Assembly
The pcb power control board assembly is10 layers,board thickness 2.4mm, Min hole size 0.3mm, HASL, High TG, BGA pad size 0.2mm.
Description
Specification
Layer: 10 layers The board thickness:2.0mm Solder mask color:Green Silkscreen:White Package:vacuum packaging Material: Fr4 The copper thickness:ENIG The min line Width:4 mil The min line Space:4 mil The max size:580*560mm Application: Industry control Product name: pcb power control board assembly | ![]() |
PCB power control board assembly processing
1. Drilling process: Advanced high-precision drilling machine with strong stability Automatic detection of tool diameter and tool change to prevent crooked drilling and leakage Minimum aperture 0.2mm | ![]() |
![]() | 2. Immersion copper/plating: Copper plating is more uniform and stable 90-minute ultra-long electroplating, copper thickness far exceeds the industry standard |
3. Circuit: Direct laser imaging, faster No film alignment error, more accurate The line is more precise, the line width and line spacing are at least 3/3mil | ![]() |
![]() | 4. Solder mask: 10,000-level clean room, automatic solder mask printing 80-minute multi-temperature baking to ensure solder mask uniformity and adhesion Comprehensively solve the risk of redness and copper exposure in the hole ring |
5. Forming: Two-table independent working mode Strong job flexibility and twice the molding speed Accuracy of gong plate +-0.1mm | ![]() |
![]() | 6. High-speed minute hand testing machine: 100% tested functional open circuit The miss rate is 0 Guarantee that every piece of shipment is a good product |
Our five advantages
![]() | (1) one-stop service, save time and save energy (2) Rich experience and high technology (3) Guarantee the processing and reliable quality (4) Better price and faster lead time (5) Better After-sales service |
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