What are the advantages and disadvantages of OSP process?

There are many PCB manufacturers today, but there are not many manufacturers who can do the OSP process well, because the processing of OSP boards requires rich experience in PCBA patch processing. So, what are the advantages and disadvantages of the OSP process?

OSP refers to the use of chemical methods to grow an organic film on a clean bare copper surface. The key to the OSP process is to control the thickness of the film. If the film is too thin, the thermal shock resistance will be poor, which will eventually affect the solderability; if the film is too thick, it will not be well fused by the flux, which will also affect the solderability.

1. OSP process advantages:

(1) low cost;

(2) High welding strength;

(3) Good weldability;

(4) The surface is smooth;

(5) Suitable for surface treatment;

(6) Easy to rework.

2. Disadvantages of OSP process:

(1) The contact resistance is high, which affects the electrical measurement;

(2) Not suitable for wire welding;

(3) Poor thermal stability, generally after a high temperature furnace, it no longer has anti-oxidation protection;

(4) The process time is short, and subsequent welding must be completed within 24 hours after the first welding;

(5) Not resistant to corrosion;

(6) The printing requirements are high, and the printing cannot be wrong, because cleaning will destroy the OSP film;

(7) The tin penetration of the wave soldering hole is poor.