RO4003C Circuit Board Material Overview

RO4003C Circuit Board Material Overview:

         RO4003C is a high-frequency circuit board material composed of a carbon-hydrogen resin system/ceramic filler reinforced with woven glass cloth. It has a stable dielectric constant (Dk), low dissipation factor, and a lower coefficient of thermal expansion, making it suitable for various microwave/radio frequency circuit designs.

Product Features and Advantages:

         RO4003C has a dielectric constant of approximately 3.38, ensuring board stability and consistency.

         Low dissipation factor enables excellent performance in high-frequency applications, providing outstanding signal transmission performance.

The lower coefficient of thermal expansion reduces the impact of thermal stress on the circuit board, enhancing its stability and reliability.

Processing technology similar to common FR-4 materials makes it easier to process and manufacture, reducing production costs.

Suitable for designs targeting performance-sensitive, large-volume applications, with competitive pricing to lower overall costs.

Typical Application Areas:

         RO4003C finds wide applications in aerospace, communications, radar, RF amplifiers, antennas, and other fields. Especially in high-frequency transmission and 5G communication systems, its excellent electrical performance and stability meet the requirements of complex circuit designs.

Fire Rating:

         It's important to note that RO4003C material has not been brominated and therefore has not passed UL 94V-0 certification. If UL 94V-0 fire rating is required for an application, consider using other materials with this certification.

        In summary, RO4003C is a high-performance, versatile high-frequency circuit board material with potential for widespread market applications, particularly suitable for fields with high demands for signal transmission performance.