RT5870 PCB High Frequency Circuit Board
Using either RT5870 dielectric material for customer's prototypes for High Frequency PCB and the simulation requires a -3dB output.And the RT5870 PCB High Frequency Circuit Board dielectric thickness: is 0.7874 mm.
Description
RT5870 PCB High Frequency Circuit Board Parameter
|
Product name: |
RT5870 PCB High Frequency Circuit Board |
Material: |
Roger RT5870 |
|
Board thickness: |
0.89mm |
Dielectric Thickness: |
0.7874 |
|
Copper thickness: |
1OZ |
PTH Cu thickness |
>=20um |
|
Soldermask: |
KSM-S6189, GL39 Green |
Silkscreen: |
TaiYo S-380W, White |
|
Surface treatment |
ENIG |
Slot size: |
0.70mm |
RT/duroid® 5870 /5880 High Frequency Laminates Datasheet
| PROPERTY | TYPICAL VALUES | DIRECTION UNDIRECTIONITS[3] | UNITS[3] | CONDCONDITIONITION | TEST METHODTEST METHOD | |||||||||
| RT/duroid 5870 | RT/duroid 5880 | |||||||||||||
| [1]Dielectric Constant, εr Process |
2.33 2.33 ± 0.02 spec. |
2.20 2.20 ± 0.02 spec. |
Z Z |
N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
||||||||
| [4]Dielectric Constant, εr Design |
2.33 | 2.20 | Z | N/A | 8 GHz - 40 GHz | Differential Phase Length Method |
||||||||
| Dissipation Factor, tan δ | 0.0005 0.0012 |
0.0004 0.0009 |
Z Z |
N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650, 2.5.5.3 10 GHz IPC-TM-2.5.5.5 |
||||||||
| Thermal Coefficient of εr | -115 | -125 | Z | ppm/°C | -50 - 150°C | IPC-TM-650, 2.5.5.5 | ||||||||
| Volume Resistivity | 2 X 107 | 2 X 107 | Z | Mohm cm | C96/35/90 | ASTM D257 | ||||||||
| Surface Resistivity | 2 X 107 | 3 X 107 | Z | Mohm | C/96/35/90 | ASTM D257 | ||||||||
| Specific Heat | 0.96 (0.23) | 0.96 (0.23) | N/A | J/g/K (cal/g/C) |
N/A | Calculated | ||||||||
| Tensile Modulus | Test at 23 °C |
Test at 100 °C |
Test at 23 °C | Test at 100 °C |
N/A | MPa (kpsi) | A | ASTM D638 | ||||||
| 1300 (189) | 490 (71) | 1070 (156) | 450 (65) | X | ||||||||||
| 1280 (185) | 430 (63) | 860 (125) | 380 (55) | Y | ||||||||||
| ultimate stress | 50 (7.3) | 34 (4.8) | 29 (4.2) | 20 (2.9) | X | |||||||||
| 42 (6.1) | 34 (4.8) | 27 (3.9) | 18 (2.6) | Y | ||||||||||
| ultimate strain | 9.8 | 8.7 | 6.0 | 7.2 | X | % | ||||||||
| 9.8 | 8.6 | 4.9 | 5.8 | Y | ||||||||||
| Compressive Modulus | 1210 (176) | 680 (99) | 710 (103) | 500 (73) | X | MPa (kpsi) | A | ASTM D695 | ||||||
| 1360 (198) | 860 (125) | 710 (103) | 500 (73) | Y | ||||||||||
| 803 (120) | 520 (76) | 940 (136) | 670 (97) | Z | ||||||||||
| ultimate stress | 30 (4.4) | 23 (3.4) | 27 (3.9) | 22 (3.2) | X | |||||||||
| 37 (5.3) | 25 (3.7) | 29 (5.3) | 21 (3.1) | Y | ||||||||||
| 54 (7.8) | 37 (5.3) | 52 (7.5) | 43 (6.3) | Z | ||||||||||
| ultimate strain | 4.0 | 4.3 | 8.5 | 8.4 | X | % | ||||||||
| 3.3 | 3.3 | 7.7 | 7.8 | Y | ||||||||||
| 8.7 | 8.5 | 12.5 | 17.6 | Z | ||||||||||
| Moisture Absorption | 0.02 | 0.02 | N/A | % | .062" (1.6mm) D48/50 |
ASTM D570 | ||||||||
| Thermal Conductivity | 0.22 | 0.20 | Z | W/m/K | 80°C | ASTM C518 | ||||||||
| Coefficient of Thermal Expansion |
22 28 173 |
31 48 237 |
X Y Z |
ppm/°C | 0-100°C | IPC-TM-650, 2.4.41 | ||||||||
| Td | 500 | 500 | N/A | °CTGA | N/A | ASTM D3850 | ||||||||
| Density | 2.2 | 2.2 | N/A | gm/cm3 | N/A | ASTM D792 | ||||||||
| Copper Peel | 27.2 (4.8) | 31.2 (5.5) | N/A | pli (N/mm) | 1 oz (35mm) EDC foil after solder float |
IPC-TM-650 2.4.8 | ||||||||
| Flammability | V-0 | V-0 | N/A | N/A | N/A | UL94 | ||||||||
| Lead-Free Process Compatible |
Yes | Yes | N/A | N/A | N/A | N/A | ||||||||
What is RT5870 PCB High Frequency Circuit Board Advantage
RT5870 is a common high-frequency PCB material with the following advantages:
- Low Dielectric Loss: RT5870 has the characteristics of low dielectric loss, which means that in high-frequency applications, it can reduce energy loss during signal transmission and help maintain signal clarity and stability.
- Excellent High-Frequency Performance: RT5870 has excellent high-frequency performance and can provide stable signal transmission and electrical performance in the high-frequency range.
- Excellent Thermal Stability: RT5870 material has good thermal stability, can maintain stable performance in high temperature environments, and is not prone to deformation or performance degradation.
- Dimensional Stability: RT5870 material has good dimensional stability and can maintain its shape and size stability even in long-term high temperature and high humidity environments.
- Processability: RT5870 material is relatively easy to process, can meet the needs of complex PCB designs, and can be processed through common PCB processing techniques
What is application of RT5870 PCB High Frequency Circuit Board
RT5870 PCB high-frequency circuit board is widely used in various high-frequency applications, mainly including the following aspects:

- Communication equipment: RT5870 PCB is widely used in wireless communication equipment, such as base station antennas, antenna distribution systems, microwave communication equipment, etc. Its low dielectric loss and excellent high-frequency performance enable efficient signal transmission and reception in these devices.
- Radar system: Radar systems need to transmit and process signals quickly and accurately in high-frequency environments. RT5870 PCB provides stable high-frequency performance and excellent thermal stability, making it a common material choice in radar systems.
- Satellite communications: Satellite communications systems have extremely high requirements for the stability and performance of signal transmission. RT5870 PCB can meet these requirements and is widely used in the manufacturing and maintenance of satellite communications equipment.
- RF electronic equipment: RF electronic equipment such as RF amplifiers, RF filters, RF switches, etc. all require high-frequency circuit boards to achieve signal processing and transmission. RT5870 PCB provides good high-frequency characteristics and dimensional stability and is suitable for these devices. manufacture.
- Medical equipment: Some medical equipment, especially wireless medical equipment, also require high-frequency circuit boards to achieve data transmission and signal processing. RT5870 PCB can meet the high-frequency performance needs of these equipment.
RT5870 PCB High Frequency Circuit Board FQA
1.What are the key characteristics of RT5870 PCB?
- RT5870 PCB typically exhibits a low dielectric constant (ε), low dielectric loss tangent (tanδ), high thermal stability, and excellent dimensional stability, making it ideal for high-frequency circuitry.
2.What applications are suitable for RT5870 PCB?
- RT5870 PCB is commonly used in various high-frequency applications such as wireless communication systems, radar systems, satellite communication devices, RF (Radio Frequency) electronic devices, and microwave circuits.
3.How does RT5870 PCB compare to other high-frequency circuit board materials?
- RT5870 PCB is known for its excellent balance of electrical properties, making it a popular choice for high-frequency applications. Compared to other materials, RT5870 PCB may offer better performance in terms of signal integrity and reliability.
4.What factors should be considered when designing with RT5870 PCB?
- When design RT5870 PCB, pcb designer should consider factors such as impedance control, signal integrity, thermal management. But no worries. When you place the order, our engineer will provide the DFM check for you. If any technical question, we will send the EQ and working Gerber for your confirmation to ensure optimal performance and reliability.
5.Where can I procure RT5870 PCB High Frequency Circuit Board?
- Beton Technology is your best choice, our factory has manufactured pcb over 18 years, and the price is competitive in the market and the quality all can be assured!
Hot Tags: rt5870 pcb high frequency circuit board, China, suppliers, manufacturers, factory, customized, buy, cheap, quotation, low price, free sample










