6-Layer ELIC Any-Layer HDI Flexible PCB For Smart Ring & Wearables
Our 6-Layer ELIC (Every Layer Interconnect) Any-Layer HDI Flexible PCB represents the pinnacle of miniaturization in FPC manufacturing. Specifically engineered for the extreme space constraints of Smart Rings and high-end wearables, this solution eliminates traditional through-holes in favor of stacked laser microvias across all layers. With a finished thickness of only 0.39mm, it offers the ultimate flexibility without compromising signal integrity or component density.
Description
Core Advantages
- Ultra-Thin Profile: 0.39mm finished thickness allows for seamless integration into circular ring cavities.
- Any-Layer Interconnect: Stacked microvias (1+1+2+1+1) unlock 30-40% more routing space compared to standard HDI.
- High-Precision Trace: 2mil/2mil (0.05mm) line width/spacing for high-density sensor arrays.
- Superior Bendability: Adhesiveless base material ensures long-term reliability under constant mechanical stress.
Technical Specifications
| Feature | Capability |
| Layer Count | 6 Layers (ELIC / Any-Layer) |
| Technology | 1+1+2+1+1 Stacked Microvias |
| Material | Polyimide (Adhesiveless) |
| Min Trace/Space | 0.05mm / 0.05mm (2mil) |
| Surface Finish | ENIG (Au ≥ 0.05μm / Ni 3-6μm) |
| Solder Mask | Matte Black (Flexible Ink) |
| Finished Thickness | 0.39mm ± 0.03mm |
| Min Laser Hole | 0.075mm (3mil) |
Technical Specifications
| Feature | Capability |
| Layer Count | 6 Layers (ELIC / Any-Layer) |
| Technology | 1+1+2+1+1 Stacked Microvias |
| Material | Polyimide (Adhesiveless) |
| Min Trace/Space | 0.05mm / 0.05mm (2mil) |
| Surface Finish | ENIG (Au ≥ 0.05μm / Ni 3-6μm) |
| Solder Mask | Matte Black (Flexible Ink) |
| Finished Thickness | 0.39mm ± 0.03mm |
| Min Laser Hole | 0.075mm (3mil) |
Key Applications
- Smart Rings: Biometric sensing (PPG, SpO2), battery management, and NFC.
- Medical Wearables: Continuous glucose monitors (CGM) and micro-sensor patches.
- Hearables: TWS earbuds and advanced hearing aids.
- AR/VR Gear: High-speed signal transmission in ultra-compact modules.
Why Choose Beton Tech for Your HDI Project?
- ELIC Experts: We specialize in the complex plating and registration required for every-layer-stacked vias.
- Advanced DFM Support: We review your Gerber files to optimize pad designs and prevent soldering defects like voiding.
- Quick-Turn Sampling: Fast prototyping to accelerate your wearable product's time-to-market.
Hot Tags: 6-Layer ELIC Any-Layer HDI Flexible PCB For Smart Ring & Wearables,Flexible PCB
