The Reason For The Virtual Welding Of Mobile Phone Wireless Charging Circuit Board Patch Processing

First, virtual welding caused by SMT process factors

1. Solder paste leakage;

2. Insufficient amount of solder paste applied;

3, steel mesh, aging, poor leakage.

Second, the virtual welding caused by the factors of the mobile phone wireless charging circuit board

1. The pads of the mobile phone wireless charging circuit board are oxidized, and the solderability is poor;

2. There are vias on the pads.

Third, virtual welding caused by component factors

1. Deformation of component pins;

2. Oxidation of component pins;

Fourth, the virtual welding caused by SMT equipment factors

1. The transfer and positioning of the placement machine on the mobile phone wireless charging circuit board is too fast, and the inertia is too large to cause the displacement of the heavier components;

2. The SPI solder paste detector and AOI inspection equipment did not detect the related solder paste coating and mounting problems in time.

Fifth, the virtual welding caused by the design factors of the mobile phone wireless charging circuit board

1. The pads do not match the size of the component pins;

2. The virtual welding caused by the metallized hole on the pad.

Sixth, virtual welding caused by operator factors

1. Abnormal operation during the baking and transfer process of the mobile phone wireless charging circuit board, resulting in deformation of the mobile phone wireless charging circuit board;

2. Illegal operations in the assembly and transfer of finished products.