What is the production process of ceramic copper clad laminate
May 25, 2022
The ceramic copper clad laminate is a thermal conduction and heat dissipation substrate that realizes metallized copper on the ceramic surface through the production technology process, and has thermal conduction, heat dissipation and electrical properties. So what are the manufacturing processes of ceramic copper clad laminates? How is the process made?
What are the production processes of ceramic copper clad laminates?
Ceramic copper clad laminates have been available since the 1980s. Due to the limitations of process technology, they did not continue to be produced. Until 2011, with the advancement of technology and the needs of the industry, they began to appear in the market again. Up to now, the production process of ceramic CCL is mainly DPC process and DBC process. The production process of Jinruixin ceramic CCL is very mature, and has more than three years of special experience in the production of ceramic plates. The two processes have their own advantages and disadvantages: DPC process has the advantages of good crystallinity of metal, good flatness, lines are not easy to fall off, and the line position is more accurate, the line spacing is smaller, and the reliability is stable, but the production cost is high, and the output is limited. Limited; DBC process, thick copper layer, fast processing, cheap price, can make multiple layers, suitable for large-area production, but cannot pass through holes, poor accuracy, rough surface, due to line width, can only be used in places with large spacing, cannot Do precision places, and only mass production can not achieve small-scale production.
What is the production process of ceramic copper clad laminates?
In the dpc thin film process, based on the thin film circuit process, the ceramic surface is metallized by magnetron sputtering, and the thickness of the copper layer and gold is more than 10 microns by electroplating. Namely DPC (Direct Copper Plating Substrate).
The DPC process is mainly: ceramic substrate pretreatment - magnetron sputtering copper - photoresist coating - exposure and development - copper electroplating - etching circuit - electroplating to increase the thickness with chemical copper.
DBC production process: aluminum nitride ceramic or alumina ceramic heating--800 ℃ high temperature melting--cooling--copper and substrate bonding--etching-complete etching circuit.
In summary, ceramic CCL can be customized with different processes, DPC ceramic CCL can achieve higher precision, DBC ceramic CCL is suitable for larger spacing, if high precision, filling holes, etc. are required, DPC process is required to complete .
