RT/duroid 6035HTC is designed specifically for high-power RF and microwave applications

RT/duroid 6035HTC is a high-performance high-frequency circuit laminate, whose unique materials and design make it outstanding in high-power RF and microwave applications.

Detailed features:
1. Material composition: RT/duroid 6035HTC is a ceramic filled PTFE (polytetrafluoroethylene) composite material, which gives it unique electrical and mechanical properties.
2. High thermal conductivity: The thermal conductivity of RT/duroid 6035HTC is approximately 2.4 times that of standard RT/duroid 6000 products. This means that it can dissipate heat more effectively, thereby reducing operating temperature and improving equipment reliability and stability.
3. Copper foil characteristics: The copper foil (ED and reverse treatment) used in this laminated board has excellent long-term thermal stability. This helps to maintain the stability of the circuit board's performance in high temperature environments.
4. Excellent drilling processing performance: Rogers' advanced filling system enables RT/duroid 6035HTC to have excellent drilling processing characteristics, which reduces drilling costs compared to standard high thermal conductivity laminates using alumina filling.
5. High frequency performance: RT/duroid 6035HTC has excellent high frequency performance, including low insertion loss and excellent thermal stability of the circuit. This makes it an ideal choice for high-power RF and microwave applications.
Application scope: RT/duroid 6035HTC is widely used in wireless infrastructure, power amplifiers, radar systems, high-speed digital, hybrid vehicles, high-voltage rail transit traction, laser systems, as well as wind and solar energy conversion and other fields.

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