The Development Trend Of Flexible And Rigid Board

Benefiting from the comprehensive advantages of PCB boards and FPC boards, flexible and rigid boards have been widely used in electronic products. In addition, since rigid-flex boards involve more material differences, all technical challenges mainly come from the selection of material combinations. For example, during multiple laminations, the CTE differences of each layer of material in all directions should be carefully considered and used in conjunction with reinforcement plates so that high-precision alignment lamination can be achieved for distortion compensation.

At the same time, the structural design of the rigid-flex board is also a hotspot of its development. In general, rigid-flex boards with equivalent functions may have numerous design options. The actual design should start with a comprehensive consideration, including product reliability, footprint, weight, and assembly complexity. In addition, the manufacturer's manufacturing capabilities and material elements should be considered for an optimal design with minimal procurement procedures. For example, common 3- to 8-layer flex-rigid boards can utilize CCL copper clad laminates with or without adhesion. Likewise, the covering layers of the flexible regions in the rigid-flex board have different structures.

Another research and development trend of flex-rigid boards lies in the manufacture of component-embedded PCBs. In most cases, the embedding of resistors and capacitors is required to be performed in rigid regions without affecting the performance of flexible regions. For the second time, this application places stringent demands on the material. In addition, flexible PCB can work normally on CSP chip scale packaging technology, while component embedded PCB structure presents challenges and requirements for packaging technology.