Proportion And Growth Trend Of Various Types Of PCB Output Value in Major Regions Of The World

In recent years, with the steady growth of my country's economy and the continuous improvement of the prosperity of the electronic information industry, my country's PCB industry will continue to maintain rapid growth. The specific table is as follows:

In 2021, the rapid development of the electronic information industry represented by 5G communication equipment, smartphones and personal computers, VR/AR and wearable devices, advanced assisted driving and unmanned vehicles, etc. From the red ocean where price wins, into the blue ocean driven by high quality and high technology. The proportion of different PCB output values in major regions of the world is as follows:

1. High multi-layer board

High multi-layer boards are mainly used in high-end servers and 5G communication base stations, as well as industrial control and medical care. It does not pursue the characteristics of light, thin and small, and there is no strict design on the circuit and aperture, but the number of layers of the product is high, mainly 24~30 layers, the alignment of drilling and back drilling, and the electroplating technology of high aspect ratio aperture bring greater challenges. According to Prismark's forecast, multi-layer boards will still maintain an important market position, and the growth rate of high-level multi-layer boards will be higher than that of middle and low-level boards. It is expected to reach 6.0% and 7.5% respectively, significantly ahead of the average growth rate of the multilayer board industry.

2. HDI

The miniaturization of electronic equipment is bound to be the miniaturization of PCB and components. The size of components tends to be miniaturized. For example, the size of SMD components (SMD) is conventionally the smallest 01005 specification (0.4mm×0.2mm), and now there is a 008004 specification (0.25mm×0.125mm), which is equivalent to mounting The occupied area ratio is reduced by about 1/2, and the wiring density of the PCB is doubled. The space given to the PCB by electronic equipment is reduced, and the function of the PCB is not reduced but increased. The development of the PCB is that the lines are thinner, the holes are smaller, the number of layers is more, and the layers are thinner.

High-density interconnect (HDI) boards have advanced from 1- or 2-level build-up interconnects to 3- or 4-order build-up and any build-up interconnects. The line width/line spacing and via-hole miniaturization of HDI board are close to IC package carrier board, which is called carrier-like board (SLP). Smartphones are the main application area of HDI boards, and with the popularization of 5G mobile phones, HDI boards will be further popularized in smartphones. Under the trend of increasingly thin and thin electronic products and diversified functions, any layer of HDI boards and similar carrier boards will accelerate the popularization and penetration in the fields of tablet computers, smart wearable devices, automotive electronics, data centers, etc., bringing the popularity of HDI boards. Incremental demand, large market space. According to Prismark data, the HDI board market will reach US$13.741 billion in 2025, with a compound growth rate of 6.7% from 2020 to 2025.

3. IC carrier board

The IC packaging substrate is the electrical interconnection channel between the integrated circuit in the chip and the external electronic circuit, and is the key carrier of the packaging and testing of the IC industry chain. The main technology and production capacity are in the hands of major PCB manufacturers in Taiwan. According to TPCA (Taiwan Circuit Board Association) statistics, this type of product accounts for about 15.1% of the overall output value of PCB in Taiwan, making it the fourth largest PCB product in Taiwan.

IC packaging substrates have the characteristics of high density, high precision, high pin count, high performance, miniaturization and thinning, and have higher requirements on various technical parameters. The continuous progress and development of electronic installation technology has put forward higher and updated requirements for PCB and its substrate materials in terms of function and performance. As the raw material with the largest proportion of sales in the packaging material segment, IC packaging substrates will also develop rapidly with the IC packaging industry. According to Prismark data, the market size of IC packaging substrates is expected to reach US$16.194 billion in 2025, with a compound growth rate of 9.7% from 2020 to 2025.

4. Rigid-flex board

The rigid-flex board has the characteristics of being able to bend and fold, and has a wide range of application scenarios. In the field of automotive electronics, automotive rigid-flex boards have been widely used in new energy vehicles due to their advantages of light weight, simple structure, convenient circuit connection, and strong reliability. In addition, some AR/VR and other wearable devices have also begun to use more rigid-flex boards.

5. Metal substrate

The higher configuration density and faster transmission rate of electronic devices bring higher heat generation. Active and passive components, mechanical connectors and heat dissipation components are all installed on the PCB, which brings severe challenges to the heat dissipation management of the PCB. challenge. In addition to optimizing component layout, increasing conductor width, and using thermal vias at the beginning of design, the best way is to use high heat-resistant and thermally conductive substrates, use metal core boards, and embed or embed metal block structures. Metal substrates represented by copper and aluminum bases have made breakthroughs in production technology and are gradually popularized in applications, with great development potential.

Although my country is already the world's largest PCB producing area, it is big but not strong. It is still dominated by low-end products such as ordinary single-sided, double-sided, and multi-layer boards. High-level multi-layer boards, HDI boards, IC packaging substrates, rigid The output value of mid-to-high-end products such as flexible bonding boards and metal substrates is relatively low, and the overall product structure is quite different from Japan and Taiwan. In the wave of vigorous development of the industry, through continuous innovation and research and development, we can win the dividends released by domestic substitution.