PCB Industry Boom
Mar 11, 2022
Chinese PCB industry PCB industry transfer
China gradually undertakes the transfer of the global PCB industry after 2000
PCB: The mother of electronic components, China undertakes the transfer of production capacity. At present, the output value of the global PCB industry accounts for more than a quarter of the total output value of the electronic component industry, and it is the subdivision of various electronic components.
industry with the largest proportion. The main upstream material of PCB is copper clad laminate, which accounts for 30% of the cost. The downstream industry is widely distributed, and the largest downstream application is communication equipment. communication equipment
The three major application fields of equipment, consumer electronics and automotive electronics together account for 62% of the market share of PCB downstream applications. Developed countries have gradually withdrawn from the production of middle and low-end products, China 2000
After the year, it will gradually undertake the transfer of the global PCB industry, and has developed into the world's largest PCB producer.
The upstream raw material boom is improving, and the production capacity of the copper clad laminate industry continues to expand. Copper clad laminate is the basic material of the electronics industry and the main material for processing and manufacturing printed circuit boards (PCBs). we recognize
Therefore, since October 2020, the year-on-year growth rate of the overall revenue of copper foil companies has shown an inflection point. In August and September 2021, the growth rate of copper foil companies narrowed month-on-month, and the year-on-year growth rate fluctuated.
move.
The three major tracks of IC carrier board, automotive board and Miniled board have a bright future. As a first-level packaging substrate with "technological homology" to PCB, IC carrier board usually has the characteristics of thinning, high density, high precision, etc.
technical features. Prismark predicts that the compound annual growth rate of the global packaging substrate output value will reach 9.7% from 2020 to 2025, of which the annual compound growth rate of the packaging substrate output value in China will reach 12.9%. in each other
Driven by the four major trends of networking, entertainment, energy saving, and safety, the level of automotive electronics is increasing, and the cost of automotive electronics in mid-to-high-end sedans has reached 28%.
The cost of vehicle electronics accounts for as high as 47%. It is estimated that the global automotive FPC market will reach 7 billion yuan in 2022, with a compound annual growth rate of 7.1%. With the continuous penetration of downstream markets, the future
The MicroL ED market will usher in growth. According to Arizton data, the global Mini LED market size will increase from US$150 million in 2021 to US$2.32 billion in 2024.
CAGR reached 149.15%. According to the CINNOResearch official account, the global Mini LED backlight substrate shipment area will increase to about 50 million square meters in 2025, with an average annual compound growth rate
CAGR will reach 72.8%
