Basic Structure Of Flexible Circuit Board
Feb 23, 2022
Copper foil substrate (Copper Film)
Copper foil: basically divided into electrolytic copper and rolled copper. Common thicknesses are 1oz 1/2oz and 1/3 oz
Substrate film: Common thicknesses are 1mil and 1/2mil.
Glue (adhesive): The thickness is determined according to customer requirements.
Cover Film Protective Film (Cover Film)
Cover film protective film: for surface insulation. Common thicknesses are 1mil and 1/2mil.
Glue (adhesive): The thickness is determined according to customer requirements.
Release paper: to prevent the adhesive from adhering to foreign matter before pressing; easy to operate.
Reinforcing plate (PI Stiffener Film)
Reinforcing board: Reinforce the mechanical strength of FPC and facilitate surface mounting operations. Common thicknesses range from 3mil to 9mil.
Glue (adhesive): The thickness is determined according to customer requirements.
Release paper: avoid the adhesive from adhering to foreign matter before pressing.
EMI: Electromagnetic shielding film to protect the circuit inside the circuit board from interference from the outside world (strong electromagnetic area or susceptible area).
